Seal method for direct liquid cooling of probes used at first level interconnect

摘要

Embodiments of an apparatus and method for providing cooling of probes for testing of integrated circuits are generally described herein. In some embodiments, an apparatus comprises a probe head assembly configured to hold one or more probes that are adapted to provide electrical contact with an integrated circuit device under test (DUT), a DUT chuck adapted to hold the DUT for contact with the probes, a seal arranged between the probe head assembly and the DUT chuck to form a chamber when the seal is in contact with the probe head assembly and the DUT chuck, and a first port and a second port arranged to provide fluid flow into and fluid flow out of the chamber.

主权项

1. An apparatus comprising:
a probe head assembly (105) configured to hold one or more probes (110), wherein the probes are adapted to provide electrical contact with an integrated circuit device under test (DUT); a DUT chuck (115) adapted to hold the DUT for contact with the probes; a seal (120) arranged between the probe head assembly and the DUT chuck to form a chamber when the seal is in contact with the probe head assembly and the DUT chuck; and a first port (130) and a second port (135) arranged to provide flow of liquid into and out of the chamber, wherein said one of said first and second ports is located within said DUT chuck.