发明名称 Infrared light detector having high resolution
摘要 An infrared light detector has a carrier membrane with at least two sensor chips thereon located next to each other. The carrier membrane has at least two rows of holes therein, proceeding parallel to each other between the sensor chips. The respective holes in one of the rows are offset with respect to the holes in an adjacent row, thereby hindering heat transmission via the carrier membrane between the sensor chips.
申请公布号 US9046420(B2) 申请公布日期 2015.06.02
申请号 US201013258914 申请日期 2010.03.18
申请人 Pyreos Ltd. 发明人 Freeborn Scott
分类号 G01J5/02;G01J5/34;H01L31/024;H01L31/09 主分类号 G01J5/02
代理机构 Edell, Shapiro & Finnan, LLC 代理人 Edell, Shapiro & Finnan, LLC
主权项 1. An infrared light detector comprising: a carrier membrane; at least two infrared sensor chips attached next to each other on a side of said carrier membrane; said carrier membrane comprising at least two hole tracks each comprising a plurality of holes, wherein at least one of the plurality of holes forms at least one blind hole open at the side of the carrier membrane at which said at least two sensor chips are located or having an opening at an opposite side of said carrier membrane opposite to the side of said carrier membrane at which said at least two sensor chips are located, said at least two hole tracks being parallel to each other between the sensor chips on the carrier membrane, and respective locations of the plurality of holes of one of said hole tracks being offset relative to respective locations of the plurality of holes in another of said hole tracks adjacent thereto, causing thermal conduction in said carrier membrane from one of said sensor chips to another of said sensor chips to be hindered by said hole tracks; and at least one thin film thermal conductor strip proceeding between adjacent sides of said at least two sensor chips on said side of said carrier membrane, said thermal conductor strip having a higher thermal conductivity than said carrier membrane and being in thermally conductive communication with said at least two sensor chips via said carrier membrane to dissipate heat from said at least two sensor chips via said thermal conductor strip to promote a low response time of said at least two sensor chips.
地址 Edingburgh GB