Thin film deposition apparatus and thin film deposition method using the same

摘要

In a thin film deposition apparatus and a thin film deposition method using the same, a first spraying unit and a second spraying unit which are separately driven are prepared, the first spraying unit is driven to sequentially spray a first deposition source and an inert gas onto a substrate, a chamber is exhausted to remove, from the chamber, excess first deposition sources that are not adsorbed onto the substrate from the chamber, a second spraying unit is driven to sequentially spray a second deposition source and an inert gas onto the substrate, and the chamber is exhausted to remove, from the chamber, excess second deposition sources that are not adsorbed onto the substrate. When the thin film deposition method is used, the unintended generation of microparticles during deposition is sufficiently suppressed.

主权项

1. A thin film deposition apparatus, comprising:
a chamber in which a substrate is placed; a first spraying unit for spraying a first deposition source onto the substrate; and a second spraying unit for spraying a second deposition source onto the substrate; wherein the first spraying unit and the second spraying unit are separately driven in the chamber; and wherein the first spraying unit and the second spraying unit scan the substrate during deposition, and wherein a scanning direction of the first spraying unit and a scanning direction of the second spraying unit run across each other.