发明名称 Optoelectronic lighting module and automotive headlamp
摘要 In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.
申请公布号 US9046258(B2) 申请公布日期 2015.06.02
申请号 US201113695966 申请日期 2011.06.24
申请人 OSRAM Opto Semiconductors GmbH 发明人 Singer Frank;Haug Thomas;Sauerer Alexander
分类号 F21V29/00;F21K99/00;H05K1/02;B60Q1/04;F21S8/10;F21Y101/02;H01L33/64 主分类号 F21V29/00
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. An optoelectronic lighting module comprising: a circuit board with an opening passing through it, wherein a material of the circuit board is all around the opening and wherein the circuit board comprises a fastening device configured to fasten the lighting module mechanically to an external heat sink; a carrier mounted in the opening; and an optoelectronic semiconductor chip mounted on top of the carrier and electrically connected to the circuit board via the carrier; wherein the circuit board is connected firmly mechanically to the carrier, wherein the circuit board is designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink, wherein the carrier is designed to rest with a carrier bottom flat against the external heat sink, wherein the carrier bottom is of a planar shape and a circuit board bottom are is of a planar shape and the carrier bottom is oriented parallel to the circuit board bottom and the carrier bottom and the circuit board bottom are freely accessible when the module is not mounted to the external heat sink, wherein the carrier bottom projects out of the opening beyond the circuit board bottom by a length of at most 100 μm; and wherein the lighting module can be handled as a single, integral unit.
地址 Regensburg DE