发明名称 Light emitting device, method for fabricating the light emitting device, light emitting device package, and lighting unit
摘要 Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting unit. The light emitting device includes a support member having a stepped portion on a side surface, a light emitting structure on the support member, the light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer to generate light, and an electrode supplying a power to the first conductive type semiconductor layer. The support member has a first surface on which the light emitting structure is disposed and a second surface having an area greater than that of the first surface.
申请公布号 US9048377(B2) 申请公布日期 2015.06.02
申请号 US201012974331 申请日期 2010.12.21
申请人 LG INNOTEK CO., LTD. 发明人 Kang Gu Cheol
分类号 H01L33/00;H01L33/20;H01L33/22;H01L33/38;H01L33/40;H01L33/44 主分类号 H01L33/00
代理机构 McKenna Long & Aldridge LLP 代理人 McKenna Long & Aldridge LLP
主权项 1. A light emitting device comprising: a support member having a stepped portion on a side surface; a light emitting structure on the support member, the light emitting structure having a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, the light emitting structure generating light; a passivation layer on a side surface of the light emitting structure and a side surface of the support member; and an electrode conducting power to the first conductive type semiconductor layer, wherein the support member has a first surface on which the light emitting structure is disposed and a second surface having an area greater than an area of the first surface, wherein the second surface is on an opposite side of the support member from the first surface, wherein the first surface and the second surface are substantially flat, wherein a width of the first surface is wider than a width of a bottom surface of the light emitting structure, and wherein the passivation layer comprises a first passivation layer extending from a top surface of the light emitting structure to a top surface of a channel layer disposed under the light emitting structure, and a second passivation layer disposed on the first passivation layer and extending from the top surface of the light emitting structure to a surface of the stepped portion of the support member.
地址 Seoul KR