发明名称 |
Formation of thin layers of semiconductor materials |
摘要 |
There is disclosed a method of forming layers of either GaAs or germanium materials such as SiGe. The germanium material, for example, may be epitaxially grown on a GaAs surface. Layer transfer is used to transfer the germanium material, along with some residual GaAs, to a receiver substrate. The residual GaAs may be then removed by selective etching, with the boundary between the GaAs and the germanium material providing an etch stop. |
申请公布号 |
US9048289(B2) |
申请公布日期 |
2015.06.02 |
申请号 |
US201013202401 |
申请日期 |
2010.02.17 |
申请人 |
IQE Silicon Compounds Limited |
发明人 |
Harper Robert Cameron |
分类号 |
H01L21/762;H01L21/02 |
主分类号 |
H01L21/762 |
代理机构 |
Hamilton, Brook, Smith & Reynolds, P.C. |
代理人 |
Hamilton, Brook, Smith & Reynolds, P.C. |
主权项 |
1. A method of forming a thin film of a germanium material, comprising:
epitaxially growing said germanium material on a surface of GaAs, said surface being carried by a donor substrate; carrying out layer transfer of the germanium material from the donor substrate to a receiver substrate with residual GaAs material from adjacent to said surface attached to said transferred germanium material; and removing the attached residual GaAs material leaving only the germanium material on the receiver substrate, wherein the germanium material is silicon germanium, denoted as SixGe1-x, such that x is in the range from 0.01 to 0.03. |
地址 |
South Glamorgan, Wales GB |