发明名称 Formation of thin layers of semiconductor materials
摘要 There is disclosed a method of forming layers of either GaAs or germanium materials such as SiGe. The germanium material, for example, may be epitaxially grown on a GaAs surface. Layer transfer is used to transfer the germanium material, along with some residual GaAs, to a receiver substrate. The residual GaAs may be then removed by selective etching, with the boundary between the GaAs and the germanium material providing an etch stop.
申请公布号 US9048289(B2) 申请公布日期 2015.06.02
申请号 US201013202401 申请日期 2010.02.17
申请人 IQE Silicon Compounds Limited 发明人 Harper Robert Cameron
分类号 H01L21/762;H01L21/02 主分类号 H01L21/762
代理机构 Hamilton, Brook, Smith & Reynolds, P.C. 代理人 Hamilton, Brook, Smith & Reynolds, P.C.
主权项 1. A method of forming a thin film of a germanium material, comprising: epitaxially growing said germanium material on a surface of GaAs, said surface being carried by a donor substrate; carrying out layer transfer of the germanium material from the donor substrate to a receiver substrate with residual GaAs material from adjacent to said surface attached to said transferred germanium material; and removing the attached residual GaAs material leaving only the germanium material on the receiver substrate, wherein the germanium material is silicon germanium, denoted as SixGe1-x, such that x is in the range from 0.01 to 0.03.
地址 South Glamorgan, Wales GB