| 发明名称 | Anisotropic conductive film and electronic device including the same | ||
| 摘要 | An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles. | ||
| 申请公布号 | US9048240(B2) | 申请公布日期 | 2015.06.02 |
| 申请号 | US201213728215 | 申请日期 | 2012.12.27 |
| 申请人 | CHEIL INDUSTRIES, INC. | 发明人 | Park Young Woo;Kim Nam Ju;Park Kyoung Soo;Seo Joon Mo;Sul Kyung Il;Uh Dong Seon;Yu Arum;Choi Hyun Min |
| 分类号 | H01B1/00;H01L23/48;H01L23/538;C09J9/02;C08G59/22;C08G59/24;H01L23/00;C08L63/00 | 主分类号 | H01B1/00 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. An electronic device, comprising: an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition, the anisotropic conductive film-forming composition including: a polycyclic aromatic ring-containing epoxy resin; a fluorene epoxy resin; nano silica; and conductive particles; wherein the fluorine epoxy resin has a boiling point of about 50 to about 80° C. | ||
| 地址 | Gumi-si, Gyeongsangbuk-do KR | ||