发明名称 |
Light emitting device package, lighting module and lighting system |
摘要 |
Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a semiconductor light emitting device, a first encapsulant over the semiconductor light emitting device, and a second encapsulant having a refractive index greater than a refractive index of the first encapsulant over the first encapsulant. |
申请公布号 |
US9048395(B2) |
申请公布日期 |
2015.06.02 |
申请号 |
US201012909098 |
申请日期 |
2010.10.21 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Kim Sun Kyung |
分类号 |
H01L33/52;H01L33/50;H01L33/56 |
主分类号 |
H01L33/52 |
代理机构 |
KED & Associates, LLP |
代理人 |
KED & Associates, LLP |
主权项 |
1. A light emitting device package comprising:
a body having a cavity; a semiconductor light emitting device including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers; a first encapsulant on the semiconductor light emitting device; a second encapsulant having a refractive index greater than a refractive index of the first encapsulant on the first encapsulant; and a third encapsulant having a refractive index greater than the refractive index of the second encapsulant and disposed on the second encapsulant, wherein the second encapsulant includes a phosphor, wherein the phosphor is spaced apart from the semiconductor light emitting device, wherein the first encapsulant is disposed on a first portion of the cavity and the second encapsulant is disposed on a second portion of the cavity, wherein the third encapsulant has a dome-shape upper portion, and wherein a width of a bottom surface of the third encapsulant is substantially the same as a width of an upper surface of the second encapsulant. |
地址 |
Seoul KR |