| 发明名称 |
Device having electrodes formed from bumps with different diameters |
| 摘要 |
A device has a first substrate having a first surface; a first electrode pad arranged on the first surface of the first substrate; a first insulator film provided on the first surface of the first substrate so that the first electrode pad is exposed; a first bump electrode provided on the first electrode pad and having a first diameter; and a second bump electrode provided on the first insulator film and having a second diameter smaller than the first diameter. |
| 申请公布号 |
US9048221(B2) |
申请公布日期 |
2015.06.02 |
| 申请号 |
US201213671033 |
申请日期 |
2012.11.07 |
| 申请人 |
PS4 Luxco S.a.r.l. |
发明人 |
Hasegawa Yu;Katagiri Mitsuaki |
| 分类号 |
H01L23/498;H01L23/48;H01L21/56;H01L25/065;H01L23/31;H01L23/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device, comprising:
a first substrate including a circuit device layer, the first substrate having a first surface; a first electrode pad arranged on the first surface of the first substrate; a first insulator film provided on the first surface of the first substrate so that the first electrode pad is exposed; a first bump electrode provided on the first electrode pad and having a first diameter; and a second bump electrode provided atop the first insulator film and having a second diameter smaller than the first diameter. |
| 地址 |
Luxembourg LU |
