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发明名称
半导体检查装置
摘要
申请公布号
TWI486600
申请公布日期
2015.06.01
申请号
TW101115859
申请日期
2012.05.03
申请人
夏普股份有限公司
发明人
斋藤仁
分类号
G01R31/26
主分类号
G01R31/26
代理机构
代理人
陈长文 台北市松山区敦化北路201号7楼;林宗宏 台北市松山区敦化北路201号7楼
主权项
一种半导体检查装置,其包含:设有复数个台座,且使该复数个台座移动之分度工作台机构;在该复数个台座上搭载复数个半导体晶片并检查该复数个半导体晶片之检查机构;及搭载于该台座上,且于内部收纳该半导体晶片并可通电之插座机构;且该插座机构系以可对该半导体晶片之上表面或下表面之各端子藉由设置于该内部之探针或端子电性连接之方式构成,且该半导体晶片藉由于所搭载之搭载面设有之反射板将来自该半导体晶片之发光照射于该内部之上方开口部。
地址
日本
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