发明名称 SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
摘要 A SOLDER ALLOY OF A TIN-SILVER-COPPER SOLDER ALLOY, CONTAINING TIN, SILVER, ANTIMONY, BISMUTH, COPPER, AND NICKEL, AND SUBSTANTIALLY DOES NOT CONTAIN GERMANIUM, RELATIVE TO THE TOTAL AMOUNT OF THE SOLDER ALLOY, THE SILVER CONTENT IS MORE THAN 1.0 MASS% AND LESS THAN 1.2 MASS%, THE ANTIMONY CONTENT IS 0.01 MASS% OR MORE AND 10 MASS% OR LESS, AND THE BISMUTH CONTENT IS 0.01 MASS% OR MORE AND 3.0 MASS% OR LESS.
申请公布号 MY154361(A) 申请公布日期 2015.06.01
申请号 MY2014PI03592 申请日期 2013.06.25
申请人 HARIMA CHEMICALS, INCORPORATED 发明人 YOJI IMAMURA;KAZUKI IKEDA;JINYU PIAO;TADASHI TAKEMOTO
分类号 B23K35/26 主分类号 B23K35/26
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