电激发光组件的封装方法;METHOD OF PACKAGING ELECTRO-LUMINESCENT DEVICE

摘要

本发明提供了一种电激发光组件的封装方法，包括提供一可挠性的薄膜；将熔接胶布设于所述薄膜的表面上形成至少一连续图案；仅在所述熔接胶的图案上涂布一层紫外光固化胶；将所述薄膜与一盖板对位，其中所述熔接胶位于所述薄膜与盖板之间；将所述薄膜上的熔接胶转移到所述盖板上；以及将所述盖板上的熔接胶与一基板接合封装，其中所述基板上已形成有至少一电激发光组件，且所述盖板上至少一熔接胶对位所述基板上的电激发光组件，本发明的电激发光组件的封装方法能够减少玻璃熔胶进入退火炉烘烤的制程，降低热应力对玻璃熔胶的改质与破坏；玻璃熔胶制作过程中，不存在Q-time的问题；可以将玻璃熔胶制作于基板或盖板上方，使用范围限制也较少。;The present invention relates to a method of packaging electro-luminescent device which comprises: providing a flexible film;disposing a welding glue on a surface of the flexible film to form at least one continuous pattern;coating a UV curable adhesive only on the pattern of the welding glue; aligning the film with a cover, wherein the welding glue is located between the film and the cover; transferring thewelding glue on the film onto the cover; and packaging the welding glue on the cover with a substrate, wherein the substrate is formed with at least one electro-luminescent device and at least one welding glue on the cover is aligned with the electro-luminescent device on the substrate.The packaging method of electro-luminescent device of the present invention can omit the baking process of the fritin the annealing furnace and prevent the frit from being modified and destroyed due to the thermal stress. There is no Q-time problems during the glass melt production process. The glass melt can be produced above the substrate or cover, with fewer usage restrictions.