LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION DEVICE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to a light emitting device package used for a display use or a lighting use, a backlight unit, a lighting device, and a method for manufacturing the light emitting device package. The light emitting device package comprises: a light emitting device in a flip chip shape where a first terminal and a second terminal are installed; a substrate in which a first electrode is formed on one side and a second electrode is formed on the other side around an electrode separation space; a first conductive bonding member installed on the first electrode to be electrically connected with the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode to be electrically connected with the second terminal of the light emitting device; a reflection encapsulating material molded and installed on the substrate to form a reflection cup unit which reflects light generated from the light emitting device, filled in the electrode separation space, and forming an electrode separation unit; and a filler filled between the reflection cup unit, the first conductive bonding member, and the second conductive bonding member.