LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT AND ILLUMINATION DEVICE

摘要

The present invention relates to a light emitting device package for a display or an illumination, a backlight unit, and an illumination device. The light emitting device package includes a flip chip type light emitting device on which a first terminal and a second terminal are installed, a substrate which includes a first electrode on one side thereof and a second electrode on the other side thereof based on an electrode separation space, a first conductive bonding member which is installed on the first electrode of the substrate to be electrically connected to the first terminal of the light emitting device, and a second conductive bonding member which is installed on the second electrode of the substrate to be electrically connected to the second terminal of the light emitting device. The first terminal of the light emitting device includes a reinforcement metal layer which is installed near the light emitting device and is made of a conductive material with a first elongation rate, and a buffering metal layer which is installed on the reinforcement metal layer and is made of a conductive material with a second elongation rate which is higher than the first elongation rate.