半导体装置量测方法;MEASURING METHOD OF SEMICONDUCTOR DEVICE

摘要

提出一种可轻易地进行物理测试而不会使特性退化之半导体装置。根据具有包含端点部分的测试元件之元件层系以具有挠性的第一与第二膜密封之半导体装置量测方法，移除形成于端点部分上的第一膜，而形成到达端点部分的接触孔；以包含导电材料的树脂填充接触孔；在将具有挠性的接线基板配置于已达成填充的树脂上之后进行加热，使得端点部分及具有挠性的接线基板系经由包含导电材料的树脂而电性连接；以及进行量测。; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.