散热基座与电子装置;HEAT-DISSIPATING BASE AND ELECTRONIC DEVICE

摘要

本发明揭露一种散热基座与电子装置。散热基座包含本体与至少一第一凸起部。第一凸起部位于本体，第一凸起部具有至少一第一凸起部顶面，第一凸起部顶面用以热接触本体上方的至少一第一元件。藉由凸出于本体的第一凸起部，第一元件可以直接热接触散热基座，于是散热基座对于第一元件的散热效果将会大幅提升。;A heat-dissipating base includes a body and at least one first protrusion. The first protrusion is disposed on the body, the first protrusion has at least one first protrusion top surface, for thermally contacting at least one first component above the body. By the first protrusion disposed on the boay, the first component may thermally contact the heat-dissipating base directly. Therefore, the heat-dissipating efficiency that the heat-dissipating base dissipates heat of the first component is greatly enhanced.