发明名称 |
MECHANISMS FOR FORMING PACKAGE STRUCTURE |
摘要 |
In accordance with some embodiments, a package structure and a method for forming the package structure are provided. The package structure includes a semiconductor die and a molding compound partially or completely encapsulating the semiconductor die. The package structure also includes a through package via in the molding compound. The package structure further includes an interfacial layer between the through package via and the molding compound. The interfacial layer includes an insulating material and is in direct contact with the molding compound. |
申请公布号 |
KR20150059635(A) |
申请公布日期 |
2015.06.01 |
申请号 |
KR20140164598 |
申请日期 |
2014.11.24 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN JING CHENG;TSAI PO HAO |
分类号 |
H01L25/065;H01L23/48 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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