The present invention relates to a microphone package capable of a back cavity and a mounting structure thereof. For this, a microphone package according to an embodiment of the present invention includes a package substrate; a sound device which is loaded on the package substrate and forms a space in a lower surface; and at least one electronic device which is loaded on the package substrate and forms a space in the lower surface. The package substrate may include a sound space for connecting the space of the sound device and the space of the electronic device.
