CARBOXYL-CONTAINING RESIN, RESIN COMPOSITION FOR USE IN SOLDER RESIST, AND MANUFACTURING PROCESS FOR CARBOXYL-CONTAINING RESIN

摘要

The objective of the present invention is to propose a carboxyl-containing resin which is less likely to gel and can form a solder mask layer with high electrical insulation reliability. The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.