| 摘要 |
A COF semiconductor package according to a first embodiment of the present invention comprises: a base film formed of a flexible film; an electrode pattern formed on the base film; a semiconductor device electrically connected to the electrode pattern, and installed on COF; a passivation layer formed on the electrode pattern, and made of an insulation material; an under fill filling a space between the semiconductor device and the passivation layer; and a heat radiation layer formed on the semiconductor device, the under fill, and the passivation layer, and radiating heat generated from the semiconductor device. The disclosed COF semiconductor package has an advantage of effectively radiating high temperature heat generated in the semiconductor device to the outside. |
