发明名称 ENCAPSULATING LAYER ADAPTED TO BE APPLIED TO BACK-SHEETS FOR PHOTOVOLTAIC MODULES INCLUDING BACK-CONTACT CELLS
摘要 The present invention provides for a multi-layered structure adapted to be applied to the surface of a back-contact back-sheet for a photovoltaic module comprising back-contact solar cells. The multi-layered structure comprises a non-extendible intermediate layer (240) comprised of a dielectric material. The multi-layered structure further comprises an upper layer (280) of an encapsulating material coupled to the upper surface (242) of the intermediate layer, as well as a lower layer (270) of a thermo-adhesive material coupled to the lower surface (244) of the intermediate layer (240). The multi-layered structure also has a plurality of through-holes pierced at predetermined positions.
申请公布号 US2015144180(A1) 申请公布日期 2015.05.28
申请号 US201314405396 申请日期 2013.05.29
申请人 EBFOIL S.R.L. 发明人 Baccini Elisa;Marras Luigi;Bucci Bruno
分类号 H01L31/049;H01L31/18;H01L31/05 主分类号 H01L31/049
代理机构 代理人
主权项 1. Multi-layered structure adapted to be applied to the surface of a back-contact back-sheet for a photovoltaic module comprising back-contact solar cells, said structure comprising: a layer of dielectric material comprising a lower surface facing the outside of said structure and an upper surface opposite said lower surface, said layer of dielectric material having a plurality of through-holes, a layer of encapsulating material coupled to said layer of dielectric material so as to be firmly fixed to said upper surface of said layer of dielectric material, said layer of encapsulating material having a plurality of through-holes, a layer of thermo-adhesive material coupled to said lower surface of said layer of dielectric material so as to allow said layer of dielectric material to steadily adhere to said surface of said back-contact back-sheet, said layer of thermo-adhesive material having a plurality of through-holes, said multi-layered structure being such that: each of said through-holes of said layer of encapsulating material is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material, and each of said through-holes of said layer of said thermal adhesive layer is made in a position corresponding to the position of one of said through-holes of said layer of dielectric material and to the position of one of said through-holes of said layer of encapsulating material, in such a way that said multi-layered structure has a plurality of through-holes.
地址 Bologna IT