| 发明名称 |
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium |
| 摘要 |
Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit. |
| 申请公布号 |
US2015147894(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201514614625 |
申请日期 |
2015.02.05 |
| 申请人 |
Hitachi Kokusai Electric Inc. |
发明人 |
HAMANO Katsuyoshi;UMEKAWA Atsushi;JODA Takuya;ISHII Akinori;OKUNO Masahisa |
| 分类号 |
H01L21/67;H01L21/268 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate processing apparatus comprising:
a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit. |
| 地址 |
Tokyo JP |
