| 发明名称 |
MEMS MICROPHONE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
There is provided a micro electro mechanical system (MEMS) microphone package including: an MEMS microphone chip having an internal space formed therein; a substrate having the MEMS microphone chip mounted thereon; an ASIC chip disposed in the internal space formed within the MEMS microphone chip; and a case bonded to the substrate and having an internal space formed therein in order to accommodate the MEMS microphone chip. |
| 申请公布号 |
US2015146888(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414171354 |
申请日期 |
2014.02.03 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Sun Ho |
| 分类号 |
H04R17/02 |
主分类号 |
H04R17/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A micro electro mechanical system (MEMS) microphone package comprising:
an MEMS microphone chip having an internal space formed therein; a substrate having the MEMS microphone chip mounted thereon; an application specific integrated circuit (ASIC) chip disposed in the internal space formed within the MEMS microphone chip; and a case bonded to the substrate and having an internal space formed therein in order to accommodate the MEMS microphone chip. |
| 地址 |
Suwon KR |
