THIN EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME

摘要

An embedded package includes a core layer having a cavity, a first semiconductor chip disposed in the cavity, and bumps disposed on a top surface of the first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip and the core layer, pads disposed on a top surface of the second semiconductor chip, and a first insulation layer disposed on the core layer and the first and second semiconductor chips. The first insulation layer has first openings that expose the bumps and second openings that expose the pads, and the first and second openings have a similar depth.

主权项

1. An embedded package comprising:
a core layer, the core layer having a cavity; a first semiconductor chip disposed in the cavity; one or more bumps disposed on a top surface of the first semiconductor chip; a second semiconductor chip disposed over the top surface of the first semiconductor chip; one or more pads disposed on a top surface of the second semiconductor chip; and a first insulation layer disposed over the core layer, the first semiconductor chip and the second semiconductor chip, wherein the first insulation layer includes:
one or more first openings having a first depth and exposing the one or more bumps; andone or more second openings having a second depth substantially the same as the first depth and exposing the one or more pads.