| 发明名称 |
Semiconductor Package with Air Gap |
| 摘要 |
A semiconductor package includes a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region. The semiconductor package further includes a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die. The film has a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap. Electrical conductors are attached at a first end to pads at the periphery region of the first main side of the semiconductor die. A corresponding method of manufacture is also provided. |
| 申请公布号 |
US2015145078(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201314090019 |
申请日期 |
2013.11.26 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Ng Chee Yang |
| 分类号 |
B81B3/00;B81C1/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region; a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die, the film having a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap; and electrical conductors attached at a first end to pads at the first or second main side of the semiconductor die. |
| 地址 |
Neubiberg DE |
