发明名称 PATTERN FORMATION METHOD AND PATTERN FORMATION DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a pattern formation method and a pattern formation device which can form a pattern of such a transparent conductive film as to unite high optical transparency and low electrical resistance, in the pattern formation device which transfers a pattern formed on a mask for pattern formation and forms a desired pattern on an object to be subjected to pattern formation.SOLUTION: An ejection part which is formed of a recessed part on the tip part and comprises primarily resin provided with liquid repellency on the surface is provided on paste ejection means of a pattern formation device, the recessed part is molded such that one edge of the recessed part is brought into contact with a mask and the other edge is protruded to the side of the mask and forms a gap between the mask and the recessed part when the ejection part is pushed against the pattern formation mask, the ejection part is moved while one edge of the recessed part is brought into contact with the mask, thereby, paste is accumulated into an area surrounded by the recessed part of the ejection part and the mask, is pushed into a pattern formed in the mask, is filled and, thereby, forms the pattern with the paste having different thickness on a center part and a surrounding part on the surface of a substrate to be subjected to pattern formation.</p>
申请公布号 JP2015098102(A) 申请公布日期 2015.05.28
申请号 JP20130238167 申请日期 2013.11.18
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 USHIFUSA NOBUYUKI;UEMURA NAOHITO;SUZUKI SHIGERU;KAJIWARA MINORU
分类号 B41F15/08;B41F15/40;H01B13/00;H05K3/12 主分类号 B41F15/08
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