| 发明名称 |
INTEGRATED CIRCUITS WITH INTERNAL PADS |
| 摘要 |
An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate. |
| 申请公布号 |
US2015145122(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414267872 |
申请日期 |
2014.05.01 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KOOG Young;WANG Jiankang;GILL Harpreet;MIN Sunghwan |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit, comprising:
a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate; wherein:
the first pads are formed on a perimeter of the substrate; andthe second pads extend from the perimeter of the substrate towards an interior of the substrate. |
| 地址 |
Suwon-si KR |
