发明名称 FLEXIBLE PRINTED CIRCUIT AND A METHOD OF FABRICATING A FLEXIBLE PRINTED CIRCUIT
摘要 Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
申请公布号 US2015144381(A1) 申请公布日期 2015.05.28
申请号 US201214396964 申请日期 2012.06.29
申请人 Foo Siang Sin;How Choong Meng 发明人 Foo Siang Sin;How Choong Meng
分类号 H05K1/11;H05K3/10 主分类号 H05K1/11
代理机构 代理人
主权项 1. A flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion, the electrically-conductive layer portion being superimposed over the substrate layer portion; wherein the substrate layer portion has an opening formed therein and part of the electrically-conductive layer portion is positioned over the opening to form a partially detachable tab, the tab being for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit.
地址 Singapore SG