BACKPLANE REINFORCEMENT AND INTERCONNECTS FOR SOLAR CELLS

摘要

Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.

主权项

1. A back contact crystalline semiconductor solar cell, comprising:
a crystalline semiconductor substrate, said substrate comprising a light capturing frontside surface and a backside surface for forming emitter and base contacts; a first electrically conductive interconnect layer having an interdigitated pattern of emitter electrodes and base electrodes on said backside surface of said crystalline substrate, said first electrically conductive interconnect layer having a thickness less than approximately 10 microns; electrically conductive emitter plugs and base plugs forming electrical connections to said emitter and base electrodes; and a backplane attached to said backside surface of said crystalline substrate by said electrically conductive plugs and providing permanent crystalline substrate reinforcement and high-conductivity solar cell interconnects, said backplane comprising:
a second electrically conductive interconnect layer providing high-conductivity cell interconnects connected to said first electrically conductive interconnect layer by said electrically conductive emitter and base plugs, said second electrically conductive interconnect layer having an interdigitated pattern of emitter electrodes and base electrodes and a metallic layer thickness in the range of approximately 25 to 250 microns; anda backplane plate attached to said second electrically conductive interconnect layer, said backplane plate having through holes exposing said emitter and base metal contacts and providing connections to the solar cell base and emitter regions using an electrically conductive material for solar cell interconnection.