发明名称 CHIP COILING TAPE ON FLEXIBLE PRINTED CIRCUIT BOARD AND CORRESPONDING BONDING METHOD FOR CHIP ON FLEXIBLE PRINTED CIRCUIT BOARD
摘要 Provided are a chip coiling tape (10) on a flexible printed circuit board and a corresponding bonding method for a chip on a flexible printed circuit board. The chip coiling tape on a flexible printed circuit board comprises a base tape (10a), a plurality of first chips (11) on a flexible printed circuit board and second chips (12) on a flexible printed circuit board, wherein the plurality of first chips on a flexible printed circuit board and second chips on a flexible printed circuit board are arranged on the base tape in the manner of an interpenetrating arrangement, are correspondingly punched to a movable platform (30) via a punching mechanism (20), and then are respectively bonded to two side edges of a liquid crystal display panel (100) via a first bonding head (41) and a second bonding head (42). A bonding operation can be conducted on two chips on a flexible printed circuit board simultaneously only by using one chip coiling tape on a flexible printed circuit board and one group of devices, so that the costs can be effectively reduced, and the productivity is improved.
申请公布号 WO2015074283(A1) 申请公布日期 2015.05.28
申请号 WO2013CN87891 申请日期 2013.11.27
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 QI, MINGHU;WU, CHUN HAO;LIN, KUN HSIEN;WANG, YONGQIANG;SHU, ZHIYOU;YANG, WEIBING;CHEN, ZENGHONG;YANG, GUOKUN;LI, CHENYANGZI;JIANG, YUNSHAO
分类号 G02F1/13 主分类号 G02F1/13
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