摘要 |
Provided are a chip coiling tape (10) on a flexible printed circuit board and a corresponding bonding method for a chip on a flexible printed circuit board. The chip coiling tape on a flexible printed circuit board comprises a base tape (10a), a plurality of first chips (11) on a flexible printed circuit board and second chips (12) on a flexible printed circuit board, wherein the plurality of first chips on a flexible printed circuit board and second chips on a flexible printed circuit board are arranged on the base tape in the manner of an interpenetrating arrangement, are correspondingly punched to a movable platform (30) via a punching mechanism (20), and then are respectively bonded to two side edges of a liquid crystal display panel (100) via a first bonding head (41) and a second bonding head (42). A bonding operation can be conducted on two chips on a flexible printed circuit board simultaneously only by using one chip coiling tape on a flexible printed circuit board and one group of devices, so that the costs can be effectively reduced, and the productivity is improved. |
申请人 |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
QI, MINGHU;WU, CHUN HAO;LIN, KUN HSIEN;WANG, YONGQIANG;SHU, ZHIYOU;YANG, WEIBING;CHEN, ZENGHONG;YANG, GUOKUN;LI, CHENYANGZI;JIANG, YUNSHAO |