发明名称 |
LED AND METHOD OF ASSEMBLING LED |
摘要 |
PROBLEM TO BE SOLVED: To efficiently improve the coupling efficiency of light generated by an LED to the exterior.SOLUTION: An LED includes: a second layer 14 of a semiconductor material forming a p-n diode together with a first layer 13 of the semiconductor material deposited on a substrate 112; a light emitting region 18 provided between the first and second layers and generating light; a first electrode 15 deposited on the second layer; and a second electrode 16 electrically connected with the first layer. Protrusions 118 and/or depressions 119 for scattering or diffracting light are provided on an upper surface of the substrate 112. A roughened surface of the upper surface of the second layer can be also used. |
申请公布号 |
JP2015099946(A) |
申请公布日期 |
2015.05.28 |
申请号 |
JP20150039913 |
申请日期 |
2015.03.02 |
申请人 |
PHILIPS LUMILEDS LIGHTNG CO LLC |
发明人 |
STEVEN D LESTER |
分类号 |
H01L33/22;H01L33/00;H01L33/02 |
主分类号 |
H01L33/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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