发明名称 PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
摘要 PROBLEM TO BE SOLVED: To provide a probe card capable of accurately bringing a contact terminal into contact with the electrode pad of an object to be inspected even when the object to be inspected is deformed.SOLUTION: A probe card 20 includes: an insulating layer 31; a contact terminal 33 formed in the insulating layer 31, and protruded from a lower surface 31A of the insulating layer 31; and a wiring pattern 32 formed on an upper surface 31B of the insulating layer 31, and equipped with rewiring to whose one end the contact terminal 33 is connected, and to whose other end a pad 32P for wire bonding is connected. The probe card 20 includes: a wiring board 40 formed with a hollow part B at a center, and structured such that wiring layers 41 to 45 and inter-layer insulating layers 46 to 50 are mutually laminated in a plurality of layers, and disposed separately from the insulating layer 31 disposed in the hollow part B; and an insulating layer 60 formed to fill the hollow part B, and configured to support the insulating layer 31 and the wiring board 40, which has elasticity modulus lower than that of the inter-layer insulating layers 46 to 50.
申请公布号 JP2015099082(A) 申请公布日期 2015.05.28
申请号 JP20130238776 申请日期 2013.11.19
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HORIUCHI MICHIO;FUKAZAWA AKIRA;MATSUDA YUICHI;TOKUTAKE YASUE
分类号 G01R1/073;G01R31/26;H01L21/66 主分类号 G01R1/073
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