发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 A method of manufacturing a semiconductor device includes forming a trench in a semiconductor body. The method further includes doping a part of the semiconductor body via sidewalls of the trench by plasma doping.
申请公布号 US2015147856(A1) 申请公布日期 2015.05.28
申请号 US201514612344 申请日期 2015.02.03
申请人 Infineon Technologies Austria AG 发明人 Irsigler Peter;Schulze Hans-Joachim
分类号 H01L29/66 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, the method comprising: forming a trench in a semiconductor body; and doping a part of the semiconductor body via sidewalls of the trench by plasma doping.
地址 Villach AT