| 主权项 |
1. A heat dissipation substrate, comprising:
a heat sink comprising a carrying portion and a plurality of supporting portions, the carrying portion having a carrying surface and a lower surface opposite to each other, the supporting portions being parallel to one another and disposed on the lower surface of the carrying portion, wherein the supporting portions are perpendicular to the carrying portion and surround an accommodating space with the carrying portion, the carrying portion has a first rough surface structure disposed on a portion of the lower surface, and the first rough surface structure is located in the accommodating space; a metal base disposed below the heat sink and having an assemble surface, wherein the metal base has a second rough surface structure disposed on a portion of the assemble surface and corresponding to the first rough surface structure, the first rough surface structure, the second rough surface structure and the supporting portions define a fluid chamber, and a working fluid flows in the fluid chamber; and at least one elastic structure disposed within the fluid chamber. |
