LIGHT-EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE PACKAGE

摘要

The present invention relates to a light-emitting device package that can be used for display or lighting purposes, a backlight unit, a lighting device, and a method for manufacturing a light-emitting device package. The light-emitting device package may comprise: a flip chip-type light-emitting device having first and second terminals installed thereon; a substrate having a first electrode formed on one side, with reference to an electrode separation space, and a second electrode formed on the other side; a first conductive bonding member installed on the first electrode of the substrate to be electrically connected to the first terminal of the light-emitting device; a second conductive bonding member installed on the second electrode of the substrate to be electrically connected to the second terminal of the light-emitting device; a reflecting sealing member molded and formed on the substrate so as to form a reflecting cup portion, which reflects light generated from the light-emitting device, the reflecting sealing member filling the electrode separation space and thereby forming an electrode separation portion; and a filling material filling the space between the reflecting cup portion and the first and second conductive bonding members.