发明名称 |
MOLECULAR LAYER DEPOSITION USING REDUCTION PROCESS |
摘要 |
A material is deposited onto a substrate by exposing the substrate to a metal-containing precursor to adsorb metal atoms of the metal-containing precursor to the substrate. The substrate injected with the metal-containing precursor is exposed to an organic precursor to deposit a layer of material by a reaction of the organic precursor with the metal atoms adsorbed to the substrate. The substrate is exposed to radicals of a reducing agent to increase reactivity of the material deposited on the substrate. The radicals of the reducing agent are produced by applying a voltage differential with electrodes to a gas such as hydrogen. The substrate may be exposed to radicals before and/or after exposing the substrate to the organic precursor. The substrate may be sequentially exposed to two or more different organic precursors. The material deposited on the substrate may be a metalcone such as Alucone, Zincone, Zircone, Titanicone, or Nickelcone. |
申请公布号 |
US2015148557(A1) |
申请公布日期 |
2015.05.28 |
申请号 |
US201414546948 |
申请日期 |
2014.11.18 |
申请人 |
Veeco ALD Inc. |
发明人 |
Lee Sang In;Hwang Chang Wan |
分类号 |
C07F5/06;C07F7/10;B05B7/00;C07F7/00;B05D1/00;B05B3/00 |
主分类号 |
C07F5/06 |
代理机构 |
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代理人 |
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主权项 |
1. A method for depositing material onto a substrate, the method comprising:
(a) exposing the substrate to a metal-containing precursor to adsorb metal atoms of the metal-containing precursor to the substrate; (b) exposing the substrate injected with the metal-containing precursor to an organic precursor to deposit a layer of material by a reaction of the organic precursor with the metal atoms adsorbed to the substrate; and (c) exposing the substrate to radicals of a reducing agent to increase reactivity of the material deposited on the substrate. |
地址 |
Fremont CA US |