| 摘要 |
<p>Provided is an electrolytic gold plating solution, in which the deposition efficiency can be improved compared with those in the conventional gold plating solutions, the time required for the deposition of a gold plating material can be shortened, the concentration of gold, which is expensive, to be contained can be reduced, and therefore can be produced at reduced cost, while keeping mechanical properties, abrasion resistance, electric properties and the like of a gold-coated film produced using the plating solution at good levels and without deteriorating the appearance of the gold-coated film. An electrolytic gold plating solution characterized by comprising a gold cyanide salt that serves as a gold source and a specific pyridinium compound in which an alkyl group is bound to a nitrogen atom located at position-1 and one to five of position-2 to position-6 are substituted by one or more specific substituents independently selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxysulfonyl group, an amino group, an alkylamino group, a dialkylamino group and a cyano group; and a gold-coated film produced by carrying out the electrolytic gold plating on a nickel coating film using the electrolytic gold plating solution.</p> |
