| 摘要 |
<p>Embodiments described herein generally relate to an improved power distribution assembly for a lamphead assembly used in a thermal processing chamber. In one embodiment, the lamphead assembly includes a plurality of lamps for thermal processing of semiconductor substrates, and a power distribution assembly having a plurality of openings, the power distribution assembly provides power to the plurality of lamps, and each opening is sized to allow passage of the lamp therethough.</p> |
