METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

Disclosed is a method for manufacturing a semiconductor package which includes the process of planarizing the surface of the semiconductor package. The method for manufacturing the semiconductor package according to the embodiment of the present invention includes the process of forming an insulation layer on a wiring layer of the semiconductor package which includes a semiconductor chip and the wiring layer which is electrically connected to a signal pad on the semiconductor chip and a separate planarization process for preventing the surface of the insulation layer from being bent due to the step of the wiring layer.