| 发明名称 |
SLURRY FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD |
| 摘要 |
The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water. |
| 申请公布号 |
US2015147884(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201314404528 |
申请日期 |
2013.05.27 |
| 申请人 |
KURARAY CO., LTD. |
发明人 |
Kato Mitsuru;Okamoto Chihiro;Kato Shinya |
| 分类号 |
H01L21/3105;C09G1/02;H01L21/762 |
主分类号 |
H01L21/3105 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A slurry for chemical mechanical polishing, comprising
abrasive grain (a), compound (b) comprising an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water. |
| 地址 |
Kurashiki-shi JP |
