PASSIVATION ASH/OXIDATION OF BARE COPPER

摘要

A semiconductor wafer has a clean, high quality Cu oxide formed at the surface of exposed Cu when an extended non-fabrication process time (such as shipping to an assembly/test site or prolonged storage) is expected.

主权项

1. A method of fabricating an integrated circuit, comprising the steps of:
processing a semiconductor wafer through the formation of a protective overcoat at a wafer fabrication facility; forming copper vias through the protective overcoat; forming a copper oxide on a surface of the copper vias, wherein the cooper oxide is a clean, high quality copper oxide; shipping the semiconductor wafer from the wafer fabrication facility to an assembly/test facility; removing the copper oxide at the assembly/test facility; and packaging the integrated circuit.