发明名称 |
ONE TRANSISTOR AND ONE RESISTIVE (1T1R) RANDOM ACCESS MEMORY (RAM) STRUCTURE WITH DUAL SPACERS |
摘要 |
The present disclosure provides methods of making resistive random access memory (RRAM) cells. The RRAM cell includes a transistor and an RRAM structure. The RRAM structure includes a bottom electrode having a via portion and a top portion, a resistive material layer on the bottom electrode having a width that is same as a width of the top portion of the bottom electrode; a capping layer over the bottom electrode, a first spacer surrounding the capping layer and a top electrode, a second spacer surround the top portion of the bottom electrode and the first spacer, and the top electrode. The RRAM cell further includes a conductive material connecting the top electrode of the RRAM structure to a metal layer. |
申请公布号 |
US2015147864(A1) |
申请公布日期 |
2015.05.28 |
申请号 |
US201514607955 |
申请日期 |
2015.01.28 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liao Yu-Wen;Chung-Shi Wen-Ting;Tu Kuo-Chi;Chang Chih-Yang;Yang Chin-Chieh;Chen Hsia-Wei;Hsieh Ching-Pei |
分类号 |
H01L45/00;H01L27/24 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of making a resistive random access memory (RRAM) cell, the method comprising:
forming a transistor on a semiconductor substrate; depositing a bottom electrode layer; depositing a resistive material layer; depositing a capping layer; depositing a top electrode layer; depositing a top electrode protective layer; forming a top electrode by patterning and etching the top electrode protective layer, the top electrode layer and the capping layer; forming a first spacer around the top electrode protective layer, the top electrode and the capping layer; forming a bottom electrode by patterning and etching the bottom electrode layer using the first spacer and the top electrode protective layer as an etch mask; andforming a second spacer around the bottom electrode and the first spacer. |
地址 |
Hsin-Chu TW |