COF-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

摘要

A COF-type semiconductor package of an embodiment is a semiconductor package for a driver IC used in a display device and comprises: a flexible film; an electrode pattern formed on the flexible film; a conductive pad electrically connected to the electrode pattern; a semiconductor device electrically connected to the electrode pattern through the conductive pad and mounted on the electrode pattern; and a first protective layer sealing the conductive pad and the semiconductor device and formed on the electrode pattern, wherein the first protective layer is characterized by comprising a heat-conducting material for dissipating heat generated by the semiconductor device.