| 摘要 |
<p> Provided are a heat-insulating film exhibiting an improved heat-insulation effect, and a heat-insulating film structure. In the heat-insulating film, porous plate-shaped fillers (1) are disposed so as to be dispersed in a matrix (3m) for binding the porous plate-shaped fillers (1). The porous plate-shaped fillers (1) are shaped as plates having an aspect ratio of 3 or above, a minimum length of 0.1-50 μm, and a porosity of 20-90%. In the heat-insulating film, the proportion of the number of porous plate-shaped fillers (1) in which the filler angle is no greater than 45º is no greater than 50%, the filler angle being the angle between the maximum-length side (1m) of the porous plate-shaped fillers (1) and a vertical line linking the center of the maximum-length side (1m) to a substrate. The heat-insulating film in which the porous plate-shaped fillers (1) are used has a longer heat conduction path than that in a case in which spherical or cubic fillers are used, making it possible to reduce thermal conductivity.</p> |
