发明名称 PROBING APPARATUS AND PROBING METHOD OF ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a probing apparatus and a probing method of an electronic device, which utilizes a change in a contour shape formed on an electrode pad when a probe and the electrode pad are pressed to each other to make it possible to recognize whether the electrode pad is brought into contact with the probe at a predetermined pressure and electric testing is properly performed.SOLUTION: A probing apparatus of an electronic device comprises: a microscope 23 which images an electrode pad and outputs a contour shape of the electrode pad as image data; and a control part 27 for determining success or failure of contact between an electrode pad and a probe 102 by comparing contour shapes of the electrode pad before and after probing or comparing an electrode pad registered frame and an outer periphery of the electrode pad detected at the time of needle mark inspection.</p>
申请公布号 JP2015099943(A) 申请公布日期 2015.05.28
申请号 JP20150035859 申请日期 2015.02.25
申请人 TOKYO SEIMITSU CO LTD 发明人 OZAWA YUICHI;IGUCHI YASUHITO;YOSHIDA TETSUO;KOSHIO JUNZO
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址