| 发明名称 |
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS |
| 摘要 |
A substrate cleaning apparatus capable of removing particles that exist in minute recesses formed on a substrate surface is disclosed. The substrate cleaning apparatus includes a substrate holder configured to hold a substrate; and a two-fluid nozzle configured to deliver a two-fluid jet onto a surface of the substrate. The two-fluid nozzle includes a first jet nozzle configured to emit a first two-fluid jet and a second jet nozzle configured to emit a second two-fluid jet at a velocity higher than a velocity of the first two-fluid jet, and the second jet nozzle surrounds the first jet nozzle. |
| 申请公布号 |
US2015144164(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414541488 |
申请日期 |
2014.11.14 |
| 申请人 |
EBARA CORPORATION |
发明人 |
ISHIBASHI Tomoatsu |
| 分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate cleaning apparatus comprising:
a substrate holder configured to hold a substrate; and a two-fluid nozzle configured to deliver a two-fluid jet onto a surface of the substrate, the two-fluid nozzle includes a first jet nozzle configured to emit a first two-fluid jet and a second jet nozzle configured to emit a second two-fluid jet at a velocity higher than a velocity of the first two-fluid jet, and the second jet nozzle surrounds the first jet nozzle. |
| 地址 |
Tokyo JP |
