发明名称 SAMPLE ENCAPSULATION SYSTEM AND METHOD
摘要 A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system.
申请公布号 US2015143928(A1) 申请公布日期 2015.05.28
申请号 US201314413715 申请日期 2013.07.16
申请人 ILLINOIS TOOL WORKS INC. 发明人 Freson Lawrence L.;Adair Kurt G.;Shewey Charles E.;Ceckowski Douglas A.;O'Flaherty Sean;Gosis Anatoly;Shkolnikov Yury;Hart Michael F.;Schmidt Daniel P.
分类号 G01N1/36;G01K13/00 主分类号 G01N1/36
代理机构 代理人
主权项 1. A sample encapsulation system comprising: a base; a chamber, the chamber having an inlet; a chamber housing in which the chamber is housed, the chamber fixedly mounted at least in part within the chamber housing, the chamber housing movably mounted to the base; a cap; a first ram operably mounted to the cap for engaging the chamber inlet; a second ram positioned in the chamber opposite the inlet, the second ram movable toward and away from the first ram, wherein the chamber and chamber housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle.
地址 Glenview IL US