发明名称 IC CHIP
摘要 <p>PROBLEM TO BE SOLVED: To provide an IC chip, applicable to, for example, a D-class amplifier, that reduces adverse effects on a circuit and the like due to ringing of a power-supply potential.SOLUTION: An IC chip 1A includes: a first external terminal 61 to which a first power-supply potential PVDD is supplied; a first pad 71 wire-bonded to the first external terminal; a first output transistor 21P having a source connected to the first pad 71; a first regulator 33 generating a second power-supply potential Vref; a third pad 73 connected to the first regulator 33 and receiving the second power-supply potential Vref; a third external terminal 63 wire-bonded to the third pad; a fourth pad 74 wire-bonded to the third external terminal 63; and a first pre-buffer 11 connected to the first pad 71 and the fourth pad 74, receiving the first power-supply potential PVDD and the second power-supply potential Vref, and supplying a first signal to a gate of the first output transistor 21P.</p>
申请公布号 JP2015100034(A) 申请公布日期 2015.05.28
申请号 JP20130239152 申请日期 2013.11.19
申请人 YAMAHA CORP 发明人 HASHIMOTO YUYA;TANAKA TAISHIN
分类号 H03F3/217;H03F1/26 主分类号 H03F3/217
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