CHIP SCALE LIGHT EMITTING DEVICE WITH METAL PILLARS IN A MOLDING COMPOUND FORMED AT WAFER LEVEL

摘要

Thick metal pillars are formed upon light emitting dies while the dies are still on their supporting wafer. A molding compound is applied to fill the space between the pillars on each die, and contact pads are formed atop the pillars. The metal pillars provide electrical contact between the contact pads and the electrical contacts of each light emitting die. The metal pillars maybe formed upon an upper metal layer of each die, and this upper metal layer maybe patterned to provide connections to individual elements within the die.

主权项

1. A method comprising:
forming a light emitting structure on a substrate, the light emitting structure including an active region sandwiched between an N-region and a P-region, and contacts to the N-region and the P-region, forming at least one first metal segment that is coupled to the contact to the N-region and at least one second metal segment that is coupled to the contact to the P-region, forming a plurality of more than two metal pillars, at least a first metal pillar being coupled to the first metal segment and at least a second metal pillar being coupled to the second metal segment, forming a filler material that occupies spaces between the pillars, and forming a first metal pad that is coupled to the first pillar and a second metal pad that is coupled to the second pillar, the first and second metal pads being situated to provide external connection to the N-region and P-region via the first and second pillars, wherein the light emitting structure includes a plurality of light emitting elements, and the method includes forming at least one third metal segment that interconnects at least two of the light emitting elements.