FORMING INTEGRATED INDUCTORS AND TRANSFORMERS WITH EMBEDDED MAGNETIC CORES

摘要

In accordance with an embodiment of the application a method of forming an integrated magnetic device is described. A prepreg or core is mounted on a carrier. A winding layer is plated and patterned on the prepreg or core. Vias are plated. The silicon is placed on a die attach pad, ensuring sufficient clearance of die to vias and d/a char. The assembly is laminated and grinded to expose the vias. A 2nd layer of vias is provided by sputtering or plating followed by laminating assembly; and grinding assembly to expose vias. The windings are plated and patterned. A solder mask (SMSK) is applied and assembly finished.

主权项

1. A method of forming an integrated magnetic device package assembly, the method comprising:
mounting a on a carrier; plating and patterning a winding layer on the core; providing a plurality of vias; plating the plurality of vias; placing silicon on a die attach pad, ensuring sufficient clearance of die to vias; laminating the assembly; grinding the assembly to expose the plurality of vias; providing a second layer of vias by sputtering; laminating the assembly again; grinding the assembly to expose the vias; plating and patterning the windings; and solder mask SMSK.